Common methods of PVD Technology- Ningbo Danko Vacuum Technology Co., Ltd.

Common methods of PVD Technology

Sputtering deposition

Sputtering is a thin film deposition technique associated with gas glow discharge. There are many sputtering methods, such as direct current sputtering, RF sputtering and reactive sputtering. Magnetron sputtering, intermediate frequencyChina PVD Coating Systems suppliers sputtering, direct current sputtering, RF sputtering and ion beam sputtering are widely used.

Characteristic: The inert gas (such as argon) needed for discharge is filled in vacuum chamber. Under the action of high voltage electric field, a large number of positive ions are produced by ionization of gas molecules. When charged ions are accelerated by a strong electric field, a high energy ion current is formed to bombard the evaporation source material (called target). Under ion bombardment, the atoms of the evaporation source material will leave the solid surface and sputter onto the substrate at high speed to deposit thin films.